R&D

Stack PKG Roadmap
Process Technology

Process Technology

Wafer Handling
chart_4p_02
Wire Bonding (Fine Pitch Technology)
chart_5p
Molding
chart_6p
Thin Wafer Back Grinding
Laser Solution

Laser Solution

Laser Grooving
chart_08_1
  • It can cut wafer which is impossible to do blade dicing (High speed & quality)
  • It can cut wafer for street width below 50um
  • Blade dicing speed can be improved after laser grooving
chart_8p
Stealth Laser Technology (GAL Process)
chart_9p
Molding Technology

Molding Technology

Advantage of Compression Mold
chart_10_1
  • Gold wire dia. reduction (1.0 0.6mil available)
  • Molding EMC resin loss decreases up to 40% (No Cull, Runner & Gate)
  • Ultra Super Wide (>95mm) substrate available
  • Wafer back grinding skip available (Top narrow gap available)
  • No mold cavity cleaning operation : COO (Cost Of Operation) Down
chart_10p
Molding Technology Trend
Transfer Mold
SEMES KPS-60V

• Wide Sub
• MCP : Vacuum

Compression Mold
TOWA, PMC1040D

• Long Wire 0.6mil / 5mm
• Low Compression Mold : low K
• High Stack , Thin Die

Cavity Moving Mold
Asahi, Yamada

• Narrow Gap Filling (50um)
• Thin POD, Low Cost
• 0.6mil 5mm / MUF
• Film Assist Mold (FAM)