Memory Storage Business

card, eMMC, USB, SSD, etc.

We Barun Electronics have a portfolio for all internal and external products such as flash memory-based memory cards, eMMCs, SSDs, etc. We are committed to delivering reliable products without defects though our reliable technical skills, high yield, strict quality control and MES systems.

Recently, memory products have evolved into MCP (Multi Chip Package) and SiP (System in Package) products, which are integrated with various functions along with miniaturization and high capacity due to the emergence of various convergence products and the rapid growth of cloud and IoT.
With the industry-leading chip stacking technology and various IC design technologies, Barun Electronics is also leading the era of the fourth industrial revolution by introducing the industry’s first 256GB microSD cards, developing UFS cards, and introducing SSD products of various capacities.

Our memory business unit uses our own brand (Barun) or OEM / ODM / EMS systems to maintain the highest level of partnership with more than 40 global companies including Samsung Electronics, Micron, Sony, Hyundai, etc.

Contact US

(445-812) #869, Jangji-ri, Dongtan-myeon, Hwaseong-si, Gyeonggi-do, Korea
Tel : +82-(0)31-8020-6000
Fax : +82-(0)31-8020-6111
Sales and product inquiries : memory@bec.co.kr

Product Introduction

Products

SD Card

SD Card

Product Features

Provides additional data storage space by inserting high-definition, over-HD–level movies as well as high-quality music and photos into digital camera, camcorder, MP3, and others
The latest SDXC/SDHC memory cards are manufactured based on an SD 3.0 standard that makes ultrahigh-speed (UHS-1) transmission possible, and they have been optimized for various multimedia devices that need high-speed reading and writing.

Application

Computer
Digital Carmera
Navigation
Black Box
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microSD Card

microSD Card

Product Features

Makes high-capacity data storage possible because it provides additional data storage space by being inserted into smartphones and digital cameras for storage of high-capacity data, such as movies, music, and photos.
The latest SDXC/SDHC memory cards are manufactured based on an SD 3.0 standard that makes ultrahigh-speed (UHS-1) transmission possible, and they have been optimized for various multimedia devices that need high-speed reading and writing.

Application

Smartphone
Digital Camera
Navigation
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USB Memory

USB Memory

Product Features

It can process even high-capacity files with high speed by complying with USB 3.0/2.0 specifications, and it is compatible with the existing USB 2.0.
You can use it right after inserting it into the USB port of PCs without separate installation work.
It protects valuable data of users by implementing solutions that can prevent data loss even in various environmental conditions with the application of waterproof and impact-resistance structural design.
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USB Memory

USB Memory
(USB OTG)

Product Features

You can freely expand the limited memory capacity of smartphones using a standard Mini USB Port without separate installation work. (higher than Android 4.x)
With the built-in USB Port in standard PC method and Mini USP Port in standard smartphone method, you can use or transfer data easily and quickly.
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USB Memory

USB Memory
(Type-C)

Product Features

USB Memory Type-C improved convenience with double-sided connector. USB Memory Type-C can connect to both Type-C Plug and Type-A Plug. You can use it to existing PC, Lap-top, Monitor, TV etc.
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SSD

SSD

Product Features

A product that applied SATA III (transfer speed of 6 GB/s) Controller of the latest technology, which can reduce booting time and increase the speed of application implementation. Perfectly compatible with a PC-standard SATA-III interface, it can replace the existing HDD. It consumes less electricity, produces less heat, and provides better durability because it is resistant to shock and vibration.
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BGA

BGA

Product Features

BGA(Ball Grid Array) is a technique which could connect chips to PCB electronically using solder ball. Solder balls are placed as a grid pattern on a two dimension.
BGA has a big amount of I/O per unit area than peripheral shpe which is only use QFP.
BGA appropriate to a high performance device like logic device.

Application

High-capacity USB
SSD
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eMMC

eMMC

Product Features

By complying with JEDEC standard eMMC 4.51, it provides improved performance and high reliability in various mobile processors and application environments. It is the optimum embedded storage solution that responds to customer requirements for high performance, low electricity, and high quality.
It is the optimum solution that responds to the changes of smartphone devices characterized by the low electricity, and high performance, and high capacity, and implement the high-specification contents of full-HD level or above.

Application

Application
Smart Phone
Tablet PC
Digital Camera
Set-top Box
Smart TV
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